Product Description:

Ceramic circuit board has good thermal and electrical properties, is an excellent power LED packaging materials, especially for multi-chip (MCM) and the substrate directly bonded chip (COB) and other packaging structure; also can be used as other high-power Power semiconductor module of the cooling circuit substrate.

Advantage:

(1) higher thermal conductivity and a more matched coefficient of thermal expansion;

(2) a more rigid, lower resistance conductive metal film;

(3) substrate solderability and good resistance to welding, the use of a wide temperature range;

(4) good insulation;

(5) conductive layer thickness of 1μm ~ 1mm adjustable;

(6) high-frequency loss, can be high-frequency circuit design and assembly;

(7) High-density assembly, line / space (L / S) resolution up to 20μm, in order to achieve the equipment is short, small, light, thin;

(8) does not contain organic ingredients, resistant to cosmic rays, high reliability in aviation and aerospace, long service life;

(9) copper layer does not contain oxide layer, can be reductive atmosphere in the long-term use.

(10) three-dimensional substrate, three-dimensional wiring.

The main parameters of products

Thermal conductivity

Thermal Conductivity of Alumina Ceramics (15 ~ 35 W / m.k)

Thermal Conductivity of Aluminum Nitride Ceramics (170-230 W / m.k)

Binding force

Up to 45MPa

Thermal expansion coefficient

With the commonly used LED chip to match

Weldability

Can be repeated at 260 ℃ welding, and in the -20 ~ 80 ℃ long-term use;

Insulation

Breakdown voltage up to 20KV / mm

Conductive layer thickness

1μm ~ 1mm adjustable

High frequency loss

Small, can be high-frequency circuit design and assembly

Line / space (L / S) resolution

Up to 20μm

Organic ingredients

Does not contain organic ingredients, resistant to cosmic rays

Oxide layer

No oxidation layer, can be reductive atmosphere for long-term use