Product Description:Ceramic circuit board has good thermal and electrical properties, is an excellent power LED packaging materials, especially for multi-chip (MCM) and the substrate directly bonded chip (COB) and other packaging structure; also can be used as other high-power Power semiconductor module of the cooling circuit substrate.    Advantage:(1) higher thermal conductivity and a more matched coefficient of thermal expansion;(2) a more rigid, lower resistance conductive metal film;(3) substrate solderability and good resistance to welding, the use of a wide temperature range;(4) good insulation;(5) conductive layer thickness of 1μm ~ 1mm adjustable;(6) high-frequency loss, can be high-frequency circuit design and assembly;(7) High-density assembly, line / space (L / S) resolution up to 20μm, in order to achieve the equipment is short, small, light, thin;(8) does not contain organic ingredients, resistant to cosmic rays, high reliability in aviation and aerospace, long service life;(9) copper layer does not contain oxide layer, can be reductive atmosphere in the long-term use.(10) three-dimensional substrate, three-dimensional wiring. The main parameters of productsThermal conductivityThermal Conductivity of Alumina Ceramics (15 ~ 35 W / m.k)Thermal Conductivity of Aluminum Nitride Ceramics (170-230 W / m.k)Binding forceUp to 45MPaThermal expansion coefficientWith the commonly used LED chip to matchWeldabilityCan be repeated at 260 ℃ welding, and in the -20 ~ 80 ℃ long-term use;InsulationBreakdown voltage up to 20KV / mmConductive layer thickness1μm ~ 1mm adjustableHigh frequency lossSmall, can be high-frequency circuit design and assemblyLine / space (L / S) resolutionUp to 20μmOrganic ingredientsDoes not contain organic ingredients, resistant to cosmic raysOxide layerNo oxidation layer, can be reductive atmosphere for long-term use